After announcing its mobile GPUs, Zen 3 APUs, and some tasty details about FidelityFX Super Resolution, AMD finished its Computex keynote by revealing its brand new 3D chiplet technology. Admittedly that’s not something you’d normally get too excited about, only this is pretty neat and capable of producing a seemingly significant performance boost for gaming.
3D chiplet technology allows for circuits to be stacked on top of each other. AMD showed off what was possible with the technology using an example of 3D vertical cache, or 3D V-cache, where the cache memory is placed on top of existing silicon. Making for some frankly crazy cache capacities.
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